MG Chemicals 8329-350G Non-Silicone Epoxy Mold Release

mg Chemicals Non-Silicone Epoxy Mold Release 12.3 oz Aerosol

• Silicone free
• Metal die compatible
• Maximum mold temperature of 260 °C [500 °F]
• Safe for thermosetting plastics, epoxies, nylons, and polystyrenes

Epoxy mold release apply to a surface before pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins. RoHS compliant.